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Modeling and Application of Flexible Electronics Packaging 1st ed. 2019 edition
Huang
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Modeling and Application of Flexible Electronics Packaging 1st ed. 2019 edition
Huang
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process.
287 pages, XVII, 287 p.
| Media | Książki Book |
| Wydane | 7 maja 2019 |
| ISBN13 | 9789811336263 |
| Wydawcy | Springer Verlag, Singapore |
| Strony | 287 |
| Wymiary | 629 g |
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