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Arbitrary Modeling of TSVs for 3D Integrated Circuits - Analog Circuits and Signal Processing Softcover reprint of the original 1st ed. 2015 edition
Khaled Salah
Arbitrary Modeling of TSVs for 3D Integrated Circuits - Analog Circuits and Signal Processing Softcover reprint of the original 1st ed. 2015 edition
Khaled Salah
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits.
188 pages, 60 black & white illustrations, 99 colour illustrations, 58 black & white tables, 5 colou
Media | Książki Paperback Book (Książka z miękką okładką i klejonym grzbietem) |
Wydane | 23 sierpnia 2016 |
ISBN13 | 9783319374970 |
Wydawcy | Springer International Publishing AG |
Strony | 179 |
Wymiary | 155 × 235 × 10 mm · 276 g |
Zobacz wszystko od Khaled Salah ( np. Hardcover Book i Paperback Book )