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Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
Jorg Franke
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zł 589,90
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Przewidywana dostawa 9 - 21 paź
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Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
Jorg Franke
Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.
356 pages
| Media | Książki Hardcover Book (Książka z twardym grzbietem i okładką) |
| Wydane | 30 kwietnia 2014 |
| ISBN13 | 9781569905517 |
| Wydawcy | Hanser Publications |
| Strony | 356 |
| Wymiary | 174 × 246 × 25 mm · 1 kg |
| Redaktor | Franke, Jorg |
Zobacz wszystko od Jorg Franke ( np. Hardcover Book i Paperback Book )