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Cover for Juan Cepeda-Rizo · Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems (Hardcover Book) (2026)

Thermal and Structural Electroni... (2026)

Juan Cepeda-Rizo

Premiera 30 grudnia 2026

Cover for Juan Cepeda-Rizo · Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems (Paperback Book) (2024)

Thermal and Structural Electroni... (2024)

Juan Cepeda-Rizo

Cover for Juan Cepeda-Rizo · Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems (Hardcover Book) (2021)

Thermal and Structural Electroni... (2021)

Juan Cepeda-Rizo