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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R 1st ed. 2018 edition
Cheng
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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier R 1st ed. 2018 edition
Cheng
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.
137 pages, 103 Illustrations, black and white; XVIII, 137 p. 103 illus.
| Media | Książki Book |
| Wydane | 18 września 2017 |
| ISBN13 | 9789811061646 |
| Wydawcy | Springer Verlag, Singapore |
| Strony | 137 |
| Wymiary | 399 g |
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